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Ministers,
Representing the following Members of the World Trade Organization (“WTO”), and States or
separate customs territories in the process of acceding to the WTO, which have agreed in
Singapore on the expansion of world trade in information technology products and which
account for well over 80 per cent of world trade in these products (“parties”):
Australia
Japan
Canada
Korea
Separate
Customs Territory of Taiwan, Penghu, Kinmen and Matsu
Norway
European
Communities
Singapore
Hong Kong
Switzerland (1)
Iceland
Turkey
Indonesia
United States
Considering the key role of trade in information technology products in the development of
information industries and in the dynamic expansion of the world economy,
Recognizing the goals of raising standards of living and expanding the production of and trade in
goods;
Desiring to
achieve maximum freedom of world trade in information technology products;
Desiring to
encourage the continued technological development of the information technology industry
on a world-wide basis;
Mindful of
the positive contribution information technology makes to global economic growth and
welfare;
Having
agreed to put into effect the results of these negotiations which involve concessions
additional to those included in the Schedules attached to the Marrakesh Protocol to the
General Agreement on Tariffs and Trade 1994, and
Recognizing that the results of these negotiations also involve some concessions offered in
negotiations leading to the establishment of Schedules annexed to the Marrakesh Protocol,
Declare
as follows:
1.
Each party’s
trade regime should evolve in a manner that enhances market access opportunities for
information technology products.
2.
Pursuant to
the modalities set forth in the Annex to this Declaration, each party shall bind and
eliminate customs duties and other duties and charges of any kind, within the meaning of
Article II:1(b) of the General Agreement on Tariffs and Trade 1994, with respect to the
following:
(a) all products classified (or classifiable) with Harmonized System (1996)
(“HS”) headings listed in Attachment A to the Annex to this Declaration; and
(b) all products specified in Attachment B to the Annex to this Declaration, whether or
not they are included in Attachment A;
through equal
rate reductions of customs duties beginning in 1997 and concluding in 2000, recognizing
that extended staging of reductions and, before implementation, expansion of product
coverage may be necessary in limited circumstances.
3.
Ministers
express satisfaction about the large product coverage outlined in the Attachments to the
Annex to this Declaration. They instruct their respective officials to make good faith
efforts to finalize plurilateral technical discussions in Geneva on the basis of these
modalities, and instruct these officials to complete this work by 31 January 1997, so as
to ensure the implementation of this Declaration by the largest number of participants.
4.
Ministers
invite the Ministers of other Members of the WTO, and States or separate customs
territories in the process of acceding to the WTO, to provide similar instructions to
their respective officials, so that they may participate in the technical discussions
referred to in paragraph 3 above and participate fully in the expansion of world trade in
information technology products.
Annex:
Modalities and Product Coverage
Attachment A:
list of HS headings
Attachment B:
list of products
Annex: Modalities and Product Coverage
back to top
Any Member of
the World Trade Organization, or State or separate customs territory in the process of
acceding to the WTO, may participate in the expansion of world trade in information
technology products in accordance with the following modalities:
1.
Each
participant shall incorporate the measures described in paragraph 2 of the Declaration
into its schedule to the General Agreement on Tariffs and Trade 1994, and, in addition, at
either its own tariff line level or the Harmonized System (1996) (“HS”) 6-digit
level in either its official tariff or any other published versions of the tariff
schedule, whichever is ordinarily used by importers and exporters. Each participant that
is not a Member of the WTO shall implement these measures on an autonomous basis, pending
completion of its WTO accession, and shall incorporate these measures into its WTO market
access schedule for goods.
2.
To this end,
as early as possible and no later than 1 March 1997 each participant shall provide all
other participants a document containing (a) the details concerning how the appropriate
duty treatment will be provided in its WTO schedule of concessions, and (b) a list of the
detailed HS headings involved for products specified in Attachment B. These documents will
be reviewed and approved on a consensus basis and this review process shall be completed
no later than 1 April 1997. As soon as this review process has been completed for any such
document, that document shall be submitted as a modification to the Schedule of the
participant concerned, in accordance with the Decision of 26 March 1980 on Procedures for
Modification and Rectification of Schedules of Tariff Concessions (BISD 27S/25).
(a) The concessions to
be proposed by each participant as modifications to its Schedule shall bind and eliminate
all customs duties and other duties and charges of any kind on information technology
products as follows:
(i)
elimination of such customs duties shall take place through rate reductions in equal
steps, except as may be otherwise agreed by the participants. Unless otherwise agreed by
the participants, each participant shall bind all tariffs on items listed in the
Attachments no later than 1 July 1997, and shall make the first such rate reduction
effective no later than 1 July 1997, the second such rate reduction no later than 1
January 1998, and the third such rate reduction no later than 1 January 1999, and the
elimination of customs duties shall be completed effective no later than 1 January 2000.
The participants agree to encourage autonomous elimination of customs duties prior to
these dates. The reduced rate should in each stage be rounded off to the first decimal;
and
(ii)
elimination of such other duties and charges of any kind, within the meaning of Article
II:1(b) of the General Agreement, shall be completed by 1 July 1997, except as may be
otherwise specified in the participant’s document provided to other participants for
review.
(b) The
modifications to its Schedule to be proposed by a participant in order to implement its
binding and elimination of customs duties on information technology products shall achieve
this result:
(i) in the
case of the HS headings listed in Attachment A, by creating, where appropriate,
sub-divisions in its Schedule at the national tariff line level; and
(ii) in the
case of the products specified in Attachment B, by attaching an annex to its Schedule
including all products in Attachment B, which is to specify the detailed HS headings for
those products at either the national tariff line level or the HS 6-digit level.
Each
participant shall promptly modify its national tariff schedule to reflect the
modifications it has proposed, as soon as they have entered into effect.
3.
Participants
shall meet periodically under the auspices of the Council on Trade in Goods to review the
product coverage specified in the Attachments, with a view to agreeing, by consensus,
whether in the light of technological developments, experience in applying the tariff
concessions, or changes to the HS nomenclature, the Attachments should be modified to
incorporate additional products, and to consult on non-tariff barriers to trade in
information technology products. Such consultations shall be without prejudice to rights
and obligations under the WTO Agreement.
4.
Participants
shall meet as soon as practicable and in any case no later than 1 April 1997 to
review the state of acceptances received and to assess the conclusions to be drawn
therefrom. Participants will implement the actions foreseen in the Declaration provided
that participants representing approximately 90 per cent of world trade
(2) in information
technology products have by then notified their acceptance, and provided that the staging
has been agreed to the participants’ satisfaction. In assessing whether to implement
actions foreseen in the Declaration, if the percentage of world trade represented by
participants falls somewhat short of 90 per cent of world trade in information technology
products, participants may take into account the extent of the participation of States or
separate customs territories representing for them the substantial bulk of their own trade
in such products. At this meeting the participants will establish whether these criteria
have been met.
5.
Participants
shall meet as often as necessary and no later than 30 September 1997 to consider any
divergence among them in classifying information technology products, beginning with the
products specified in Attachment B. Participants agree on the common objective of
achieving, where appropriate, a common classification for these products within existing
HS nomenclature, giving consideration to interpretations and rulings of the Customs
Co-operation Council (also known as the World Customs Organization or
“WCO”). In
any instance in which a divergence in classification remains, participants will consider
whether a joint suggestion could be made to the WCO with regard to updating existing HS
nomenclature or resolving divergence in interpretation of the HS nomenclature.
6.
The
participants understand that Article XXIII of the General Agreement will address
nullification or impairment of benefits accruing directly or indirectly to a WTO Member
participant through the implementation of this Declaration as a result of the application
by another WTO Member participant of any measure, whether or not that measure conflicts
with the provisions of the General Agreement.
7.
Each
participant shall afford sympathetic consideration to any request for consultation from
any other participant concerning the undertakings set out above. Such consultations shall
be without prejudice to rights and obligations under the WTO Agreement.
8.
Participants
acting under the auspices of the Council for Trade in Goods shall inform other Members of
the WTO and States or separate customs territories in the process of acceding to the WTO
of these modalities and initiate consultations with a view to facilitate their
participation in the expansion of trade in information technology products on the basis of
the Declaration.
9.
As used in
these modalities, the term “participant” shall mean those Members of the WTO, or
States or separate customs territories in the process of acceding to the WTO, that provide
the document described in paragraph 2 no later than 1 March 1997.
10.
This Annex
shall be open for acceptance by all Members of the WTO and any State or any separate
customs territory in the process of acceding to the WTO. Acceptances shall be notified in
writing to the Director-General who shall communicate them to all participants.
There are two
attachments to the Annex.
Attachment A lists the HS headings or parts thereof to be covered.
Attachment B lists specific products to be covered by an ITA wherever they are classified
in the HS .
Attachment
A, Section 1
back to top
| |
HS96 |
|
HS description |
| |
3818 |
|
Chemical elements doped for use in electronics, in form of discs, wafers or
similar forms; chemical compounds doped for use in electronics |
| |
8469 |
11 |
Word processing machines |
| |
8470 |
|
Calculating machines and pocketsize data recording, reproducing and displaying
machines with a calculating function; accounting machines, postage franking machines,
ticketissuing machines and similar machines, incorporating a calculating devices; cash
registers: |
| |
8470 |
10 |
Electronic calculators capable of operating without an external source of
electric power and pocket size data recording, reproducing and displaying machines with
calculating functions |
| |
8470 |
21 |
Other electronic calculating machines incorporating a printing device |
| |
8470 |
29 |
Other |
| |
8470 |
30 |
Other calculating machines |
| |
8470 |
40 |
Accounting machines |
| |
8470 |
50 |
Cash registers |
| |
8470 |
90 |
Other |
| |
8471 |
|
Automatic data processing machines and units thereof; magnetic or optical
readers, machines for transcribing data onto data media in coded form and machines for
processing such data, not elsewhere specified or included: |
| |
8471 |
10 |
Analogue or hybrid automatic data processing machines |
| |
8471 |
30 |
Portable digital automatic data processing machines, weighing no more than 10 kg,
consisting of at least a central processing unit, a keyboard and a display |
| |
8471 |
41 |
Other digital automatic data processing machines comprising in the same housing
at least a central processing unit and an input and output unit, whether or not combined |
| |
8471 |
49 |
Other digital automatic data processing machines presented in the form of systems
|
| |
8471 |
50 |
Digital processing units other than those of subheading 8471 41 and 8471 49,
whether or not in the same housing one or two of the following types of units : storage
units, input units, output units |
| |
8471 |
60 |
Input or output units, whether or not containing storage units in the same
housing |
| |
8471 |
70 |
Storage units, including central storage units, optical disk storage units, hard
disk drives and magnetic tape storage units |
| |
8471 |
80 |
Other units of automatic data processing machines |
| |
8471 |
90 |
Other |
| ex |
8472 |
90 |
Automatic teller machines |
| |
8473 |
21 |
Parts and accessories of the machines of heading No 8470 of the electronic
calculating machines of subheading 8470 10, 8470 21 and 8470 29 |
| |
8473 |
29 |
Parts and accessories of the machines of heading No 8470 other than the
electronic calculating machines of subheading 8470 10, 8470 21 and 8470 29 |
| |
8473 |
30 |
Parts and accessories of the machines of heading No 8471 |
| |
8473 |
50 |
Parts and accessories equally suitable for use with machines of two or more of
the headings Nos. 8469 to 8472 |
| ex |
8504 |
40 |
Static converters for automatic data processing machines and units thereof, and
telecommunication apparatus |
| ex |
8504 |
50 |
Other inductors for power supplies for automatic data processing machines and
units thereof, and telecommunication apparatus |
| |
8517 |
|
Electrical apparatus for line telephony or line telegraphy, including line
telephone sets with cordless handsets and telecommunication apparatus for carriercurrent
line systems or for digital line systems; videophones: |
| |
8517 |
11 |
Line telephone sets with cordless handsets |
| |
8517 |
19 |
Other telephone sets and videophones |
| |
8517 |
21 |
Facsimile machines |
| |
8517 |
22 |
Teleprinters |
| |
8517 |
30 |
Telephonic or telegraphic switching apparatus |
| |
8517 |
50 |
Other apparatus, for carriercurrent line systems or for digital line systems |
| |
8517 |
80 |
Other apparatus including entryphone systems |
| |
8517 |
90 |
Parts of apparatus of heading 8517 |
| ex |
8518 |
10 |
Microphones having a frequency range of 300 Hz to 3,4 KHz with a diameter of not
exceeding 10 mm and a height not exceeding 3 mm, for telecommunication use |
| ex |
8518 |
30 |
Line telephone handsets |
| ex |
8518 |
29 |
Loudspeakers, without housing, having a frequency range of 300 Hz to 3,4 KHz with
a diameter of not exceeding 50 mm, for telecommunication use |
| |
8520 |
20 |
Telephone answering machines |
| |
8523 |
11 |
Magnetic tapes of a width not exceeding 4 mm |
| |
8523 |
12 |
Magnetic tapes of a width exceeding 4 mm but not exceeding 6,5 mm |
| |
8523 |
13 |
Magnetic tapes of a width exceeding 6,5 mm |
| |
8523 |
20 |
Magnetic discs |
| |
8523 |
90 |
Other |
| |
8524 |
31 |
Discs for laser reading systems for reproducing phenomena other than sound or
image |
| ex |
8524 |
39 |
Other : — for reproducing
representations of instructions, data, sound, and image, recorded in a machine readable
binary form, and capable of being manipulated or providing interactivity to a user, by
means of an automatic data processing machine |
| |
8524 |
40 |
Magnetic tapes for reproducing phenomena other than sound or image |
| |
8524 |
91 |
Media for reproducing phenomena other than sound or image |
| ex |
8424 |
99 |
Other : — for reproducing
representations of instructions, data, sound, and image, recorded in a machine readable
binary form, and capable of being manipulated or providing interactivity to a user, by
means of an automatic data processing machine |
| ex |
8525 |
10 |
Transmission apparatus other than apparatus for radiobroadcasting or television
|
| |
8525 |
20 |
Transmission apparatus incorporating reception apparatus |
| ex |
8525 |
40 |
Digital still image video cameras |
| ex |
8527 |
90 |
Portable receivers for calling, alerting or paging |
| ex |
8529 |
10 |
Aerials or antennae of a kind used with apparatus for radiotelephony and
radiotelegraphy |
| ex |
8529 |
90 |
Parts of: transmission apparatus
other than apparatus for radiobroadcasting or television
transmission
apparatus incorporating reception apparatus
digital still
image video cameras,
portable
receivers for calling, alerting or paging |
| |
8531 |
20 |
Indicator panels incorporating liquid crystal devices (LCD) or light emitting
diodes (LED) |
| ex |
8531 |
90 |
Parts of apparatus of subheading 8531 20 |
| |
8532 |
|
Electrical capacitors, fixed, variable or adjustable (preset): |
| |
8532 |
10 |
Fixed capacitors designed for use in 50/60 Hz circuits and having a reactive
power handling capacity of not less than 0,5 kvar (power capacitors) |
| |
8532 |
21 |
Tantalum fixed capacitors |
| |
8532 |
22 |
Aluminium electrolytic fixed capacitors |
| |
8532 |
23 |
Ceramic dielectric, single layer fixed capacitors |
| |
8532 |
24 |
Ceramic dielectric, multilayer fixed capacitors |
| |
8532 |
25 |
Dielectric fixed capacitors of paper or plastics |
| |
8532 |
29 |
Other fixed capacitors |
| |
8532 |
30 |
Variable or adjustable (preset) capacitors |
| |
8532 |
90 |
Parts |
| |
8533 |
|
Electrical resistors (including rheostats and potentiometers), other than heating
resistors: |
| |
8533 |
10 |
Fixed carbon resistors, composition or film types |
| |
8533 |
21 |
Other fixed resistors for a power handling capacity not exceeding 20 W |
| |
8533 |
29 |
Other fixed resistors for a power handling capacity of 20 W or more |
| |
8533 |
31 |
Wirewound variable resistors, including rheostats and potentiometers, for a power
handling capacity not exceeding 20 W |
| |
8533 |
39 |
Wirewound variable resistors, including rheostats and potentiometers, for a power
handling capacity of 20 W or more |
| |
8533 |
40 |
Other variable resistors, including rheostats and potentiometers |
| |
8533 |
90 |
Parts |
| |
8534 |
|
Printed circuits |
| ex |
8536 |
50 |
Electronic AC switches consisting of optically coupled input and output circuits
(Insulated thyristor AC switches) |
| ex |
8536 |
50 |
Electronic switches, including temperature protected electronic switches,
consisting of a transistor and a logic chip (chiponchip technology) for a voltage not
exceeding 1000 volts |
| ex |
8536 |
50 |
Electromechanical snapaction switches for a current not exceeding 11 amps |
| ex |
8536 |
69 |
Plugs and sockets for coaxial cables and printed circuits |
| ex |
8536 |
90 |
Connection and contact elements for wires and cables |
| |
8541 |
|
Diodes, transistors and similar semiconductor devices; photosensitive
semiconductor devices, including photovoltaic cells whether or not assembled in modules or
made up into panels; lightemitting diodes; mounted piezoelectric crystals: |
| |
8541 |
10 |
Diodes, other than photosensitive or lightemitting diodes |
| |
8541 |
21 |
Transistors, other than photosensitive transistors, with a dissipation rate of
less than 1 W |
| |
8541 |
29 |
Transistors, other than photosensitive transistors, with a dissipation rate of 1
W or more |
| |
8541 |
30 |
Thyristors, diacs and triacs, other than photosensitive devices |
| |
8541 |
40 |
Photosensitive semiconductor devices, including photovoltaic cells whether or not
assembled in modules or made up into panels; light emitting diodes |
| |
8541 |
50 |
Other semiconductor devices |
| |
8541 |
60 |
Mounted piezoelectric crystals |
| |
8541 |
90 |
Parts |
| |
8542 |
|
Electronic integrated circuits and microassemblies |
| |
8542 |
12 |
Cards incorporating an electronic integrated circuit (‘smart’ cards) |
| |
8542 |
13 |
Metal oxide semiconductors (MOS technology) |
| |
8542 |
14 |
Circuits obtained by bipolar technology |
| |
8542 |
19 |
Other monolithic digital integrated circuits, including circuits obtained by a
combination of bipolar and MOS technologies (BIMOS technology) |
| |
8542 |
30 |
Other monolithic integrated circuits |
| |
8542 |
40 |
Hybrid integrated circuits |
| |
8542 |
50 |
Electronic microassemblies |
| |
8542 |
90 |
Part |
| |
8543 |
81 |
Proximity cards and tags |
| ex |
8543 |
89 |
Electrical machines with translation or dictionary functions |
| ex |
8544 |
41 |
Other electric conductors, for a voltage not exceeding 80 V, fitted with
connectors, of a kind used for telecommunications |
| ex |
8544 |
49 |
Other electric conductors, for a voltage not exceeding 80 V, not fitted with
connectors, of a kind used for telecommunications |
| ex |
8544 |
51 |
Other electric conductors, for a voltage exceeding 80 V but not exceeding 1000 V,
fitted with connectors, of a kind used for telecommunications |
| |
8544 |
70 |
Optical fibre cables |
| |
9009 |
11 |
Electrostatic photocopying apparatus, operating by reproducing the original image
directly onto the copy (direct process)] |
| |
9009 |
21 |
Other photocopying apparatus, incorporating an optical system |
| |
9009 |
90 |
Parts and accessories |
| |
9026 |
|
Instruments and apparatus for measuring or checking the flow, level, pressure or
other variables of liquids or gases (for example, flow meters, level gauges, manometers,
heat meters), excluding instruments and apparatus of heading No 9014, 9015, 9028 or 9032: |
| |
9026 |
10 |
Instruments for measuring or checking the flow or level of liquids |
| |
9026 |
20 |
Instruments and apparatus for measuring or checking pressure |
| |
9026 |
80 |
Other instruments and apparatus for measuring or checking of heading 9026 |
| |
9026 |
90 |
Parts and accessories of instruments and apparatus of heading 9026 |
| |
9027 |
20 |
Chromatographs and electrophoresis instruments |
| |
9027 |
30 |
Spectrometers, spectrophotometers and spectrographs using optical radiations (UV,
visible, IR) |
| |
9027 |
50 |
Other instruments and apparatus using optical radiations (UV, visible, IR) of
heading No 9027 |
| |
9027 |
80 |
Other instruments and apparatus of heading No 9027 (other than those of heading
No 9027 10) |
| ex |
9027 |
90 |
Parts and accessories of products of heading 9027, other than for gas or smoke
analysis apparatus and microtomes |
| |
9030 |
40 |
Instruments and apparatus for measuring and checking, specially designed for
telecommunications (for example, crosstalk meters, gain measuring instruments,
distorsion factor meters, psophometers) |
Attachment
A, Section 2 back to top
Semiconductor manufacturing and testing equipment and parts thereof
| |
HS Code |
Description |
Comments |
| ex |
7017 10 |
Quartz reactor tubes and holders designed for insertion into diffusion and
oxidation furnaces for production of semiconductor wafers |
For Attachment B |
| ex |
8419 89 |
Chemical vapor deposition apparatus for semiconductor production |
For Attachment B |
| ex |
8419 90 |
Parts of chemical vapor deposition apparatus for semiconductor production |
For Attachment B |
| ex |
8421 19 |
Spin dryers for semiconductor wafer processing |
|
| ex |
8421 91 |
Parts of spin dryers for semiconductor wafer processing |
|
| ex |
8424 89 |
Deflash machines for cleaning and removing contaminants from the metal leads of
semiconductor packages prior to the electroplating process |
|
| ex |
8424 89 |
Spraying appliances for etching, stripping or cleaning semiconductor wafers |
|
| ex |
8424 90 |
Parts of spraying appliances for etching, stripping or cleaning semiconductor
wafers |
|
| ex |
8456 10 |
Machines for working any material by removal of material, by laser or other light
or photo beam in the production of semiconductor wafers |
|
| ex |
8456 91 |
Apparatus for stripping or cleaning semiconductor wafers |
For Attachment B |
| |
8456 91 |
Machines for dryetching patterns on semiconductor materials |
|
| ex |
8456 99 |
Focused ion beam milling machines to produce or repair masks and reticles for
patterns on semiconductor devices |
|
| ex |
8456 99 |
Lasercutters for cutting contacting tracks in semiconductor production by laser
beam |
For Attachment B |
| ex |
8464 10 |
Machines for sawing monocrystal semiconductor boules into slices, or wafers into
chips |
For Attachment B |
| ex |
8464 20 |
Grinding, polishing and lapping machines for processing of semiconductor wafers |
|
| ex |
8464 90 |
Dicing machines for scribing or scoring semiconductor wafers |
|
| ex |
8466 91 |
Parts for machines for sawing monocrystal semiconductor boules into slices, or
wafers into chips |
For Attachment B |
| ex |
8466 91 |
Parts of dicing machines for scribing or scoring semiconductor wafers |
For Attachment B |
| ex |
8466 91 |
Parts of grinding, polishing and lapping machines for processing of semiconductor
wafers |
|
| ex |
8466 93 |
Parts of focused ion beam milling machines to produce or repair masks and
reticles for patterns on semiconductor devices |
|
| ex |
8466 93 |
Parts of lasercutters for cutting contacting tracks in semiconductor production
by laser beam |
For Attachment B |
| ex |
8466 93 |
Parts of machines for working any material by removal of material, by laser or
other light or photo beam in the production of semiconductor wafers |
|
| ex |
8456 93 |
Parts of apparatus for stripping or cleaning semiconductor wafers |
For Attachment B |
| ex |
8466 93 |
Parts of machines for dryetching patterns on semiconductor materials |
|
| ex |
8477 10 |
Encapsulation equipment for assembly of semiconductors |
For Attachment B |
| ex |
8477 90 |
Parts of encapsulation equipment |
For Attachment B |
| ex |
8479 50 |
Automated machines for transport, handling and storage of semiconductor wafers,
wafer cassettes, wafer boxes and other material for semiconductor devices |
For Attachment B |
| ex |
8479 89 |
Apparatus for growing or pulling monocrystal semiconductor boules |
|
| ex |
8479 89 |
Apparatus for physical deposition by sputtering on semiconductor wafers |
For Attachment B |
| ex |
8479 89 |
Apparatus for wet etching, developing, stripping or cleaning semiconductor wafers
and flat panel displays |
For Attachment B |
| ex |
8479 89 |
Die attach apparatus, tape automated bonders, and wire bonders for assembly of
semiconductors |
For Attachment B |
| ex |
8479 89 |
Encapsulation equipment for assembly of semiconductors |
For Attachment B |
| ex |
8479 89 |
Epitaxial deposition machines for semiconductor wafers |
|
| ex |
8479 89 |
Machines for bending, folding and straightening semiconductor leads |
For Attachment B |
| ex |
8479 89 |
Physical deposition apparatus for for semiconductor production |
For Attachment B |
| ex |
8479 89 |
Spinners for coating photographic emulsions on semiconductor wafers |
For Attachment B |
| ex |
8479 90 |
Part of apparatus for physical deposition by sputtering on semiconductor wafers |
For Attachment B |
| ex |
8479 90 |
Parts for die attach apparatus, tape automated bonders, and wire bonders for
assembly of semiconductors |
For Attachment B |
| ex |
8479 90 |
Parts for spinners for coating photographic emulsions on semiconductor wafers |
For Attachment B |
| ex |
8479 90 |
Parts of apparatus for growing or pulling monocrystal semiconductor boules |
|
| ex |
8479 90 |
Parts of apparatus for wet etching, developing, stripping or cleaning
semiconductor wafers and flat panel displays |
For Attachment B |
| ex |
8479 90 |
Parts of automated machines for transport, handling and storage of semiconductor
wafers, wafer cassettes, wafer boxes and other material for semiconductor devices |
For Attachment B |
| ex |
8479 90 |
Parts of encapsulation equipment for assembly of semiconductors |
For Attachment B |
| ex |
8479 90 |
Parts of epitaxial deposition machines for semiconductor wafers |
|
| ex |
8479 90 |
Parts of machines for bending, folding and straightening semiconductor leads |
For Attachment B |
| ex |
8479 90 |
Parts of physical deposition apparatus for for semiconductor production |
For Attachment B |
| ex |
8480 71 |
Injection and compression moulds for the manufacture of semiconductor devices |
|
| ex |
8514 10 |
Resistance heated furnaces and ovens for the manufacture of semiconductor devices
on semiconductor wafers |
|
| ex |
8514 20 |
Inductance or dielectric furnaces and ovens for the manufacture of semiconductor
devices on semiconductors wafers |
|
| ex |
8514 30 |
Apparatus for rapid heating of semiconductor wafers |
For Attachment B |
| ex |
8514 30 |
Parts of resistance heated furnaces and ovens for the manufacture of
semiconductor devices on semiconductor wafers |
|
| ex |
8514 90 |
Parts of apparatus for rapid heating of wafers |
For Attachment B |
| ex |
8514 90 |
Parts of furnaces and ovens of Headings No 8514 10 to No 8514 30 |
|
| ex |
8536 90 |
Wafer probers |
For Attachment B |
| |
8543 11 |
Ion implanters for doping semiconductor materials |
|
| ex |
8543 30 |
Apparatus for wet etching, developing, stripping or cleaning semiconductor wafers
and flat panel displays |
For Attachment B |
| ex |
8543 90 |
Parts of apparatus for wet etching, developing, stripping or cleaning
semiconductor wafers and flat panel displays |
For Attachment B |
| ex |
8543 90 |
Parts of ion implanters for doping semiconductor materials |
|
| |
9010 41 to 9010 49 |
Apparatus for projection, drawing or plating circuit patterns on sensitized
semiconductor materials and flat panel displays |
|
| ex |
9010 90 |
Parts and accessories of the apparatus of Headings No 9010 41 to 9010 49 |
|
| ex |
9011 10 |
Optical stereoscopic microscopes fitted with equipment specifically designed for
the handling and transport of semiconductor wafers or reticles |
For Attachment B |
| ex |
9011 20 |
Photomicrographic microscopes fitted with equipment specifically designed for the
handling and transport of semiconductor wafers or reticles |
For Attachment B |
| ex |
9011 90 |
Parts and accessories of optical stereoscopic microscopes fitted with equipment
specifically designed for the handling and transport of semiconductor wafers or reticles |
For Attachment B |
| ex |
9011 90 |
Parts and accessories of photomicrographic microscopes fitted with equipment
specifically designed for the handling and transport of semiconductor wafers or reticles |
For Attachment B |
| ex |
9012 10 |
Electron beam microscopes fitted with equipment specifically designed for the
handling and transport of semiconductor wafers or reticles |
For Attachment B |
| ex |
9012 90 |
Parts and accessories of electron beam microscopes fitted with equipment
specifically designed for the handling and transport of semiconductor wafers or reticles |
For Attachment B |
| ex |
9017 20 |
Pattern generating apparatus of a kind used for producing masks or reticles from
photoresist coated substrates |
For Attachment B |
| ex |
9017 90 |
Parts and accessories for pattern generating apparatus of a kind used for
producing masks or reticles from photoresist coated substrates |
For Attachment B |
| ex |
9017 90 |
Parts of such pattern generating apparatus |
For Attachment B |
| |
9030 82 |
Instruments and apparatus for measuring or checking semiconductor wafers or
devices |
|
| ex |
9030 90 |
Parts and accessories of instruments and apparatus for measuring or checking
semiconductor wafers or devices |
|
| ex |
9030 90 |
Parts of instruments and appliances for measuring or checking semiconductor
wafers or devices |
|
| |
9031 41 |
Optical instruments and appliances for inspecting semiconductor wafers or devices
or for inspecting masks, photomasks or reticles used in manufacturing semiconductor
devices |
|
| ex |
9031 49 |
Optical instruments and appliances for measuring surface particulate
contamination on semiconductor wafers |
|
| ex |
9031 90 |
Parts and accessories of optical instruments and appliances for inspecting
semiconductor wafers or devices or for inspecting masks, photomasks or reticles used in
manufacturing semiconductor devices |
|
| ex |
9031 90 |
Parts and accessories of optical instruments and appliances for measuring surface
particulate contamination on semiconductor wafers |
|
Positive list
of specific products to be covered by this agreement wherever they are classified in the
HS.
Where parts are specified, they are to be covered in accordance with HS Notes 2(b) to
Section XVI and Chapter 90, respectively.
| Computers: automatic data processing machines capable of 1) storing the
processing program or programs and at least the data immediately necessary for the
execution of the program; 2) being freely programmed in accordance with the requirements
of the user; 3) performing arithmetical computations specified by the user; and 4)
executing, without human intervention, a processing program which requires them to modify
their execution, by logical decision during the processing run. The agreement covers
such automatic data processing machines whether or not they are able to receive and
process with the assistance of central processing unit telephony signals, television
signals, or other analogue or digitally processed audio or video signals. Machines
performing a specific function other than data processing, or incorporating or working in
conjunction with an automatic data processing machine, and not otherwise specified under
Attachment A or B, are not covered by this agreement. |
| Electric amplifiers
when used as repeaters in line telephony products falling within this agreement, and parts
thereof |
| Flat panel displays
(including LCD, Electro Luminescence, Plasma and other technologies) for products falling
within this agreement, and parts thereof. |
| Network equipment:
Local Area Network (LAN) and Wide Area Network (WAN) apparatus, including those products
dedicated for use solely or principally to permit the interconnection of automatic data
processing machines and units thereof for a network that is used primarily for the sharing
of resources such as central processor units, data storage devices and input or output
units including adapters, hubs, inline repeaters, converters, concentrators, bridges
and routers, and printed circuit assemblies for physical incorporation into automatic data
processing machines and units thereof. |
| Monitors : display
units of automatic data processing machines with a cathode ray tube with a dot screen
pitch smaller than 0,4 mm not capable of receiving and processing television signals or
other analogue or digitally processed audio or video signals without assistance of a
central processing unit of a computer as defined in this agreement. The agreement does
not, therefore, cover televisions, including high definition televisions.
(3) |
| Optical disc storage
units, for automatic data processing machines (including CD drives and DVDdrives),
whether or not having the capability of writing/recording as well as reading, whether or
not in their own housings. |
| Paging alert devices ,
and parts thereof . |
| Plotters whether input
or output units of HS heading No 8471 or drawing or drafting machines of HS heading No
9017. |
| Printed Circuit
Assemblies for products falling within this agreement, including such assemblies for
external connections such as cards that conform to the PCMCIA standard. Such printed circuit
assemblies consist of one or more printed circuits of heading 8534 with one or more active
elements assembled thereon, with or without passive elements “Active elements”
means diodes, transistors, and similar semiconductor devices, whether or not
photosensitive, of heading 8541, and integrated circuits and micro assemblies of heading
8542. |
| Projection type flat
panel display units used with automatic data processing machines which can display digital
information generated by the central processing unit. |
| Proprietary format
storage devices including media therefor for automatic data processing machines, with or
without removable media and whether magnetic, optical or other technology, including
Bernoulli Box, Syquest, or Zipdrive cartridge storage units. |
| Multimedia upgrade
kits for automatic data processing machines, and units thereof, put up for retail sale,
consisting of, at least, speakers and/or microphones as well as a printed circuit assembly
that enables the ADP machines and units thereof to process audio signals (sound cards). |
| Set top boxes which
have a communication function : a microprocessorbased device incorporating a modem for
gaining access to the Internet, and having a function of interactive information exchange |
|
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Notes:
1.
On behalf of the customs union Switzerland and Liechtenstein. back to text
2.
This percentage shall be calculated by the WTO Secretariat on the
basis of the most recent data available at the time of the meeting. back to text
3.
Participants will conduct a review of this product description in
January 1999 under the consultation provisions of paragraph 3 of the
Declaration. back to text
|
